Semiconductor
Encapsulation
RF Microwave and Datacom
Gold Wedge
IPC-A-610 Class 2 & 3
Dam and Fill
Class 10
Complex Microelectronic Assemblies For Lidar
ITAR Registered
Flip Chip
Gold Ball
Military
Industrial
Manufacturing
Complex SMT Assemblies
Electronics
Automotive
Quick-turn NPI Support
Specializing in Precision Die Attach
000 Clean Room
ISO 9001: 2015
Aluminum Wedge Wirebonding
Medical
Aerospace
Engineering Process Development From Prototype To Production