Basic info
Industry
appliances, electrical, and electronics manufacturing
Sectors
Encapsulation
Wafer level packaging
stacked dies assembly
MEMS
Flip Chip
IC Packaging
Micro-optics
Product Design
MCM
Photonics assembly
Diode assembly
SIP
Manufacturing
Microelectromechanical systems (MEMS) assembling
wire bonding
Electronics
Prism assembly
Chip on board
Active Alignment
Die attach
micro assembly
Microelectronics
lenses assembly
Wirebonding
Chip on flex
bare die assembly
Date founded
1998