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Carbice

27 employees

Carbice is developing a product used to dissipate heat away from product packaging to stop electronic devices from overheating.

Basic info

Industry

semiconductor manufacturing

Sectors

Semiconductor
assembly
Reduced packaging waste and clean assembly
Extend product life
Easy to use satellite assembly heat dissipation materials
innovation
Industry leading thermal tape
Energy Management
Industrial Engineering
High linear compression and conductivity gap pads
Industrial Design
Easy rework of electronic packages
Lower total ownership cost
Multifunctional performance that simplifies BOM
Thermal super capacitors for power management
Faster installation
Automatic Test Equipment
Increased performance at smaller product size and cost
Mechanically compliant metal solder
Highest thermal conductivity technology

Date founded

2011

Funding rounds raised

Total raised

$15M

from 5 investors over 5 rounds

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Carbice raised undisclosed on May 9, 2023

Investors: Portfolia

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Carbice raised $15M on November 23, 2020

Investors: Starbridge Venture Capital and Toyota Ventures

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Carbice raised $1.5M on July 19, 2017

Investors: GRA Venture Fund LLC and TechSquare Labs

FAQ