C

ClassOne Technology

71 employees

Basic info

Industry

semiconductor manufacturing

Sectors

Metal Lift-Off
Gold Plating
Wafer Level Packaging Plating Processes
Advanced Semiconductor Plating
Resist Strip
Low-Stress Ni Plating
Cu Plating (Cu RDL
Au
Cu Bumps
Ti
Cu TSV Plating
BEOL & FEOL Wafer Cleans
Au Plating
Sn
Ni
Electroplating (Cu
Cu Pillars)
etc...)

Date founded

2013

FAQ