Basic info
Industry
machinery manufacturing
Sectors
R&D Equipment
Photonics
Eutectic Bonding
Flip Chip Bonder
Manual Die Bonder
Precision engineering
Chip on Submount Assembly
SMD Rework
Sub-Micron Bonding
High Power Laser Bonding
Application and process support
Production Equipment
Automated Die Bonder
Si Photonics
Epoxy Bonding
Optical Transceiver Assembly
Detector Bonding
Sensor Assembly
Date founded
1992