Basic info
Industry
machinery manufacturing
Sectors
R&D Equipment
High Power Laser Bonding
Automated Die Bonder
Application and process support
Epoxy Bonding
Production Equipment
Precision engineering
Sub-Micron Bonding
SMD Rework
Detector Bonding
Sensor Assembly
Optical Transceiver Assembly
Photonics
Eutectic Bonding
Si Photonics
Manual Die Bonder
Chip on Submount Assembly
Flip Chip Bonder
Date founded
1992