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J-Devices Corporation

71 employees

Basic info

Industry

semiconductor manufacturing

Sectors

PBGA with Heatslug
improved PBGA
Copper Wire bond
Design and Characterization
Assembly and Test turn-key solution
Fluxless Reflow
Automotive
Chip-on-Chip
Package (WFOP)
Leaded
Wafer Fan-Out
Power products
SIP
BGA
Stud Bump Bonding FCBGA

Date founded

1970

FAQ