Basic info
Industry
semiconductor manufacturing
Sectors
LED package decapsulation
Semiconductor
Underfill
Copper wire decapsulation
PdCu
die attach etching
Ag
Electronics
Au wire decapsulation
Advanced IC package decapsulation
SAW BAW filter decapsulation
FOW
Cu
Silver wire decapsulation
O2 only plasma decapsulation
Thermally stressed package decapsulation
SIP & module decapsulation
Plasma decapsulation systems
EOS exposure
Electrical Distribution
3D stacked die package decapsulation
Date founded
2014