Chip Scale Packaging
Robotic Hot Solder Dip
Lead Attach
FPGA
PEM-Quals
Hi-rel Microelectronic Components
Radiation Tolerant
JANTX
MIL-PRF-19500
Hi-Rel Memory
Assembly Services
Robotic Hot Solder Dipping
Hi-Rel Power Supplies
Die Attach
Radiation Hardened
MIL-SPEC Connectors
BGA Reballing
Space-Grade
JANS
Upscreening
Engineering & Analytical Services
Hi-Rel Diodes
Flip Chip/MCM
ANSI/ESD S20.20
Advanced Interconnect Technology
MIL-STD-1553 Data Bus Couplers
Component Modification
Wafer Level Packaging
High-Reliability Microelectronics
Hi-Rel Microelectronics
Column Attach
Data Bus Products
Device Characterization Testing
Full Turnkey Test Services
Wafer Bumping
ASIC
RF Testing
Electrical & Environmental Test
JOSCAR Registered
DMEA Trusted Source
Hardware
DLA Certified
ASIC Design
CGA
Component Modification Services
MIL-PRF-38534
Bare Die
MIL-PRF-38535
NADCAP
Diodes
Custom Packaging
SMD/5962 Hi-Rel Products
COTS
JAN
Die & Wafer Processing
Counterfeit Mitigation
Wafer Probe
Rad-Hard