Column Attach
Component Modification
Rad-Hard
ASIC Design
FPGA
Hi-rel Microelectronic Components
JANS
Counterfeit Mitigation
MIL-STD-1553 Data Bus Couplers
Assembly Services
Robotic Hot Solder Dip
Wafer Bumping
DMEA Trusted Source
Custom Packaging
Hardware
Robotic Hot Solder Dipping
Flip Chip/MCM
Hi-Rel Diodes
Radiation Hardened
Radiation Tolerant
Hi-Rel Microelectronics
JOSCAR Registered
Electrical & Environmental Test
Bare Die
ANSI/ESD S20.20
Device Characterization Testing
JANTX
Full Turnkey Test Services
CGA
COTS
Diodes
SMD/5962 Hi-Rel Products
Wafer Level Packaging
Hi-Rel Memory
Data Bus Products
MIL-PRF-19500
Upscreening
BGA Reballing
Component Modification Services
NADCAP
MIL-SPEC Connectors
JAN
Lead Attach
Space-Grade
Hi-Rel Power Supplies
Engineering & Analytical Services
ASIC
DLA Certified
Chip Scale Packaging
MIL-PRF-38535
MIL-PRF-38534
Wafer Probe
High-Reliability Microelectronics
RF Testing
Die & Wafer Processing
Die Attach
PEM-Quals
Advanced Interconnect Technology