Basic info
Industry
semiconductor manufacturing
Sectors
Semiconductor
Wafer Re-sizing
Industrial
Taiko Grinding
Process development
300mm-76mm handling capabilities
Wafer Dicing
Test Wafer Reclaim Services
Dice Before Grinding
Oxide
CMP Services - Polysilicon
Edge Chamfering or Rounding.
Ultra Low Metals Cleaning
Germanium
Manufacturing
Supplier of Reclaim or Test Wafers
Date founded
1985