Basic info
Industry
semiconductor manufacturing
Sectors
Semiconductor
CMP Services - Polysilicon
Edge Chamfering or Rounding.
Dice Before Grinding
Wafer Dicing
Oxide
Process development
Taiko Grinding
300mm-76mm handling capabilities
Wafer Re-sizing
Germanium
Industrial
Test Wafer Reclaim Services
Supplier of Reclaim or Test Wafers
Manufacturing
Ultra Low Metals Cleaning
Date founded
1985