Basic info
Industry
machinery manufacturing
Sectors
Solder Deballing
Laser Assisted Bonding
Selective Chip Rework
Wafer Dicing
3D Packaging
Wafer Level Packaging
Wafer Level Solder Balling
Solder Ball Rework
Spin Coating
Solder Ball Jetting
Pin Bonding
3.5D Multilayer Die Stacking
Solder Reballing
Backend Assembly
Packaging Services
Wafer Sawing
Laser
Manufacturing
Prototyping Services
Solder Bumping
Electronics
electroless-Ni/Au Plating
Wafer Level UBM Plating
Gang Ball Placement
Robot Soldering
Mikroelektronik
Date founded
1995