Basic info
Industry
machinery manufacturing
Sectors
Solder Bumping
Packaging Services
Robot Soldering
Electronics
Solder Reballing
Solder Ball Jetting
Spin Coating
Backend Assembly
Wafer Dicing
Pin Bonding
Wafer Level Solder Balling
Solder Deballing
Wafer Sawing
3D Packaging
Manufacturing
Solder Ball Rework
Wafer Level UBM Plating
Mikroelektronik
Gang Ball Placement
Wafer Level Packaging
electroless-Ni/Au Plating
Prototyping Services
Laser
Laser Assisted Bonding
3.5D Multilayer Die Stacking
Selective Chip Rework
Date founded
1995