Semiconductor
Double-side substrates with metallized vias
Dielectric strength up to 4000 V ВС
MOSFETs
Substrates for COB and flip chip technologies
High Thermal Conductivity PCB 120W/m*K
Substrates for UV curing
Substrates for power modules (IPMs
IGBTs)
PCBs for power electronics
Thermal Management
Substrates for IF and laser applications
Manufacturing