Six Sigma Microelectronics is an expert in the modification and testing of integrated circuits to enable commercial devices to be used in severe (or rugged) environments, such as high-reliability military and space applications. Our services include: column attach, BGA reballing, robotic hot solder dip, failure analysis, and testing. Our testing options include: solderability, leak testing, column pull, bond pull, ball shear, XRF, X-ray, and mark permanency.