Basic info
Industry
semiconductor manufacturing
Sectors
wafer level packaging (WLP)
dry-release etch
Plasma Dicing
wafer processing solutions
DRIE
Silicon Carbide (SiC)
FOWLP
VCSELs
through-silicon vias (TSVs)
silicon etch
Via Reveal
XeF2 vapor release etch
HF release etch
Advanced Packaging
dielectric etch
MVD
MEMS
Compound Semiconductors
PECVD
PiezoMEMS
PVD