Basic info
Industry
semiconductor manufacturing
Sectors
through-silicon vias (TSVs)
dry-release etch
Plasma Dicing
HF release etch
FOWLP
DRIE
PECVD
Silicon Carbide (SiC)
MEMS
dielectric etch
Via Reveal
PiezoMEMS
wafer level packaging (WLP)
XeF2 vapor release etch
Compound Semiconductors
VCSELs
Advanced Packaging
wafer processing solutions
MVD
PVD
silicon etch