Basic info
Industry
appliances, electrical, and electronics manufacturing
Sectors
Encapsulation
ISO9001
Miniaturization
SiP and MCM
FDA registered
Bare die circuits
Medical devices
Robotics
Sensors assembly
HTCC
Manufacturing
Wedge bonding
Ceramic
Photonics
Heavy gauge wire-bonding
AS9100D
Precision SMT
Hybrid circuits
Thin wire-bonding
Flip-Chip
Thick film
Ruggedized applications
Print and Fire
Cleanroom
ISO13485
thin pitch assembly
Die-Attach processes
Microelectronics
Engineering services
Microelectronics packaging
Multi-layer screen printing
Medical
Aerospace
Ball bonding
Thick film hybrid circuits
Date founded
1987