Investor insights
Sectors invested in
Automotive2
Information Technology1
Software1
Industrial Automation1
Electronic Design Automation (EDA)1
AI1
Deep learning1
Artificial Intelligence1
Image processing1
ADAS1
perception1
computational imaging1
Computer vision1
neural network1
Machine Learning1
Algorithm1
autonomous driving1
Intelligent Systems1
Funding rounds participated in
$266M sweet spot round size
Most of their 3 investments are in rounds between $266M and $266M
Basic info
Industry
semiconductor manufacturing
Sectors
手机终端 smartphone
芯片 chips
Mobile
制造业 Manufacturing
IoT
Consumer Electronics
5G
晶圆制造 Wafer Fab
半导体 semiconductor
IDM ODM
电信 communications
Laptop笔电业务
Manufacturing
Date founded
2006
Investments made
合
合见工软 raised $266M on November 23, 2021
Investors: Sequoia Capital China, Shenzhen Capital Group Co., Ltd, 华勤技术, Summitview Capital and PT Wingtech Technology Indonesia
B
Black Sesame Technologies Inc raised undisclosed on September 22, 2021
Investors: FutureX Capital 天际资本, Summitview Capital, Lenovo Capital and Incubator Group and PT Wingtech Technology Indonesia
北
北京车联天下信息技术有限公司 raised undisclosed on September 25, 2017
Investors: NIO Capital, NavInfo and PT Wingtech Technology Indonesia